(University of California – Santa Barbara) The steady improvement of the performance and versatility of our electronic systems is due in large part to the scaling-down of transistors and interconnects that drive them. Components on the chips have been shrunk, stacked and more densely packed to add increased functionality without expanding the systems’ small footprints.

Original source: https://www.eurekalert.org/pub_releases/2019-03/uoc–ppl031419.php